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Browse Prior Art Database

Fabricating Metal Lines Without the Use of Photoresist

IP.com Disclosure Number: IPCOM000085932D
Original Publication Date: 1976-Jun-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Hochberg, F: AUTHOR

Abstract

This is a method of fabricating metal lines on a substrate without the use of photoresist which is useful, for example, in gas panel applications.

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Fabricating Metal Lines Without the Use of Photoresist

This is a method of fabricating metal lines on a substrate without the use of photoresist which is useful, for example, in gas panel applications.

A substrate 2 has a layer of a first metal 4, for example Cu, and then a second metal 6, for example Ni, deposited thereon. The metal layers are then selectively exposed at areas 8, 10 and 12 to an electron or laser beam or locally heated to cause alloying in the exposed areas. The substrate 2 is then etched, and the nonexposed areas 14, 16, 18 and 20 etch rapidly leaving metal lines only in the areas 8, 10 and 12.

Alternatively, the layers 4 and 6 could be quartz and phosphorous, respectively, with the exposed areas 8, 10 and 12 etching more rapidly, leaving channels in the areas 8, 10 and 12.

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