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Water Cooling Plate for Card On Board Packages

IP.com Disclosure Number: IPCOM000085992D
Original Publication Date: 1976-Jul-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Archey, WB: AUTHOR

Abstract

The described cooling plate design permits effective cooling of high-circuit density card-on-board packages, which dissipate over 2 1/2 watts per module and over 100 watts per card.

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Water Cooling Plate for Card On Board Packages

The described cooling plate design permits effective cooling of high-circuit density card-on-board packages, which dissipate over 2 1/2 watts per module and over 100 watts per card.

Historically, card-on-board packages run out of chip placement capability, pin count, and air cooling ability almost simultaneously.

With the advent of multilayered ceramic modules, available chip placement capability and pin count increases drastically, effectively eliminating air cooling as a practical avenue. Thus in such construction, water cooling becomes attractive.

As shown in the figure, it is possible to design a water cooling plate to fit between adjacent card positions in a standard card construction, providing that all components on a card are of a standard planar height. As shown, a conventional multilayered organic printed-circuit board 10 carrying a plurality of modules 11 on its surface, is provided with a series of through holes 12 regularly spaced over its entire surface. The card is mounted in a suitable connector block
13.

Positioned on the back side of the card 10 is a hollow metal cooling plate 14 having an internal water flow cavity 15 and a plurality of cooling studs 16 extending from its surface. These studs pass through the through holes 12 provided in the printed-circuit board 10.

The surface of the cooling plate 14 between the studs 16 is covered with an insulation sheet 17, and the surface of each stud is coat...