Browse Prior Art Database

Cooling and Minimizing Temperature Gradient in Stacked Modules

IP.com Disclosure Number: IPCOM000085993D
Original Publication Date: 1976-Jul-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Audi, RD: AUTHOR

Abstract

Described is a technique for cooling and minimizing the temperature gradient in stacked modules by providing a direct heat transfer path from the upper substrate in a stacked module to the exterior can covering the modules, so that improved cooling of the module is achieved.

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Cooling and Minimizing Temperature Gradient in Stacked Modules

Described is a technique for cooling and minimizing the temperature gradient in stacked modules by providing a direct heat transfer path from the upper substrate in a stacked module to the exterior can covering the modules, so that improved cooling of the module is achieved.

Specifically, such improvement is achieved by inverting the upper deck so that the chips are face-to-face with those of the lower deck, and by sandwiching a conductive elastomer sheet between the inverted upper substrate and the surface of the cap to create a direct thermal path for cooling.

The module is shown in the figure and comprises a lower substrate 10, an upper substrate 11 affixed thereto by pins 12 with each substrate carrying a plurality of semiconductor devices 13. Over the entire arrangement a metallic cap 14 is affixed by crimping the cap 14 to the lower substrate 10. As shown in the figure a conductive elastomer 16 is positioned between the back side of the upper substrate 11 and the inner surface of the cap 14.

By inverting the upper substrate 11, as shown, the semiconductor devices 13 are face-to-face with those on the lower substrate 10. By providing a continuous sheet of conductive elastomer 16 between the back side of the upper substrate 11 and the cap 14, a direct large area heat transfer path for the heat generated on the upper substrate is provided. This not only allows greater power dissipation per module,...