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Porosity Test Method for Peel Apart Copper

IP.com Disclosure Number: IPCOM000086000D
Original Publication Date: 1976-Jul-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Ellis, TL: AUTHOR [+2]

Abstract

Peel apart copper is made by plating on a copper or aluminum carrier a thin layer of copper that can be separated after being laminated to a dielectric material. Typically the copper or aluminum carrier will be about 3 mils thick and the thin copper layer to be laminated to the laminate is about 0.2 mil thick.

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Porosity Test Method for Peel Apart Copper

Peel apart copper is made by plating on a copper or aluminum carrier a thin layer of copper that can be separated after being laminated to a dielectric material. Typically the copper or aluminum carrier will be about 3 mils thick and the thin copper layer to be laminated to the laminate is about 0.2 mil thick.

After the peel apart copper is laminated to the dielectric material, the carrier layer is peeled off leaving the 0.2 mil copper sheet laminated to the dielectric. To check the porosity of the thin copper layer laminated to the dielectric, prior to lamination a coating of a dye penetrant is applied to the oxide side of the peel apart copper material as indicated in the figure.

After allowing the dye to remain on the surface for a short period of time, the excess dye is dried off with a clean cloth. Then the dielectric material is placed between two peel apart copper sheets, with the dielectric material against the dyed surfaces and the lamination lay-up takes place. After the laminate is cured, the carrier sheet is peeled away leaving the 0.2 mil copper sheets on both sides of the dielectric material. If the 0.2 mil copper layer is porous, the dye will be visible on the separated surface.

Alternatively, rather than placing the dye on the oxide side of the peel apart copper sheets, the dye can be applied to the surfaces of the dielectric material prior to lamination.

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