Browse Prior Art Database

Lamination of Metal Directly to Green Sheet Dielectric Material

IP.com Disclosure Number: IPCOM000086004D
Original Publication Date: 1976-Jul-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Sondej, WR: AUTHOR [+2]

Abstract

Unfired green sheet ceramic material can be used as a base material for printed-circuit boards.

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Lamination of Metal Directly to Green Sheet Dielectric Material

Unfired green sheet ceramic material can be used as a base material for printed-circuit boards.

Ceramic material normally used as a dielectric material application, such as, for a capacitive decoupled internal plane, is fired at specific temperatures, pressures, and time periods.

By laminating directly to the green sheet ceramic material before the sheet is fired, certain advantages may be obtained. The sheet is soft and pliable and it can be cut by ordinary scissors into almost any shape. Lamination of the green sheet material is much easier and more economical to carry out and when the material is laminated between two sheets of copper, it does not break or fracture when the copper is bent. Also, drilling of the green sheet material is greatly facilitated. The electrical properties of the green sheet material are similar to those when it is in a fired state.

The green sheet material is applicable to printed-circuit cards and boards and is considered to be an ideal dielectric material, for example, for a capacitive decoupled internal plane. It may also find usage in the mounting of chips.

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