Browse Prior Art Database

Barrier to Prevent Run In

IP.com Disclosure Number: IPCOM000086006D
Original Publication Date: 1976-Jul-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Cutting, L: AUTHOR [+2]

Abstract

One technique of fabricating integrated circuit modules is to place a metallic cap over a ceramic substrate which has the desired circuitry thereon. The edges between the cap and the ceramic substrate are sealed with an epoxy to prevent gaseous contaminants from entering the module.

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Barrier to Prevent Run In

One technique of fabricating integrated circuit modules is to place a metallic cap over a ceramic substrate which has the desired circuitry thereon. The edges between the cap and the ceramic substrate are sealed with an epoxy to prevent gaseous contaminants from entering the module.

One problem frequently encountered when fabricating such modules is that when the epoxy sealant is applied, it tends to run into the inside of the package causing damage to the circuitry on the substrate.

This run-in can be prevented by lining the inside of the cap with a layer of a silicone gel such as SYLGARD*. The SYLGARD is placed on the inside edge of the cap and it is cured prior to the time that the cap is placed over the substrate. After the SYLGARD is cured, the cap is placed over the substrate and the epoxy sealant is applied to the joint between the cap and the substrate. The SYLGARD prevents the epoxy sealant from running into the module. * Trademark of Dow Corning Corporation

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