Browse Prior Art Database

Deburring of Multilayer Ceramic Substrates

IP.com Disclosure Number: IPCOM000086017D
Original Publication Date: 1976-Jul-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Tompkins, RE: AUTHOR

Abstract

This is an apparatus and technique for processing green, multilayer, ceramic (MLC) substrate laminates through a deburring operation.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Deburring of Multilayer Ceramic Substrates

This is an apparatus and technique for processing green, multilayer, ceramic (MLC) substrate laminates through a deburring operation.

Multilayer ceramic substrates having 30 or more layers of ceramic with metal embedded therein are used as carriers for semiconductor circuit chips. MLC 30- layer substrates are sectioned (sawed) to approximately final dimensions while still in the "green sheet" (unfired) form.

Following sectioning, but prior to final processing, the substrate must be deburred. This operation involves removing a 4-6 mil thick crust projection, which may extend as much as 40 mils beyond the surface plane edges of the substrate, without chamfering or otherwise damaging such edges (8) by excessive handling.

The substrate is loaded on a vacuum chuck (manual operation) then is passed through four brushes rotating in opposite directions, running against top and bottom edges of the substrate to prevent delaminating of multilayers. When the substrate passes completely through the brushes, the vacuum chuck rotates 90 degrees and in passing back through the brushes deburrs the opposite sides of the substrate.

1

Page 2 of 2

2

[This page contains 2 pictures or other non-text objects]