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Integrated Circuit Master Slice Concept

IP.com Disclosure Number: IPCOM000086019D
Original Publication Date: 1976-Jul-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Cass, EE: AUTHOR [+2]

Abstract

Prior to the development of the integrated circuit master slice concept, the particular integrated circuit configuration was determined by the combination of a specific layout or configuration of the semiconductor regions in the horizontal plane, and a specific metallization configuration interconnecting these regions.

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Integrated Circuit Master Slice Concept

Prior to the development of the integrated circuit master slice concept, the particular integrated circuit configuration was determined by the combination of a specific layout or configuration of the semiconductor regions in the horizontal plane, and a specific metallization configuration interconnecting these regions.

With the development of the master slice concept, the horizontal semiconductor region layout was maintained in a fixed generalized configuration applicable to the wide variety of ultimate circuit configurations, and the ultimate circuit configuration was determined solely by the configuration of the metallization connected to selected regions in the generalized horizontal layout.

In accordance with the present approach, with the development of ion implantation and related conductivity-determining impurity introduction approaches wherein the tailoring of the substrate itself has been greatly facilitated, it is now possible to utilize a generalized and fixed metallization layout, and tailor the ultimate integrated circuit configuration solely by varying the configuration of the regions determining the horizontal substrate layout.

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