Browse Prior Art Database

Minicontact Probe for Testing Chips

IP.com Disclosure Number: IPCOM000086027D
Original Publication Date: 1976-Jul-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Barkhuff, ED: AUTHOR [+2]

Abstract

For certain test equipment chip probes, it is desirable for the probe beams to be as short as possible to minimize the electrical path length. Present buckling beam probes are undesirably long for these applications.

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Minicontact Probe for Testing Chips

For certain test equipment chip probes, it is desirable for the probe beams to be as short as possible to minimize the electrical path length. Present buckling beam probes are undesirably long for these applications.

Fig. 1 shows a chip 1 with contact pads 2 being probed by a mini-probe, a number of very short, rigid pins 3 inserted into properly spaced holes in a support block 4 between the chip and a nonconducting force unit 5. A small diameter, flexible, insulated wire 6, is attached to each pin 3 and these are dressed down the spaces between rows of pins.

Alternatively, in order to make Kelvin type measurements, two such wires may be attached to each pin 3. For clarity, however, only one wire per pin is shown in the sketch. The attachment (Fig. 2) is preferably by resistance welding, but soldering has also been used. The probe units may be used as either voltage or signal lines. Voltage lines are attached to an adjacent decoupling capacitor 7.

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