Browse Prior Art Database

Compensation Mechanism for Uniform Sputtering

IP.com Disclosure Number: IPCOM000086058D
Original Publication Date: 1976-Jul-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Gartner, HM: AUTHOR [+2]

Abstract

In conventional sputtering of quartz, the spacing between the cathode and anode is fixed. As a result, the distance between the top surfaces of wafers on the anode plate are in the same plane making the distances between the cathode and the wafer surfaces identical.

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Compensation Mechanism for Uniform Sputtering

In conventional sputtering of quartz, the spacing between the cathode and anode is fixed. As a result, the distance between the top surfaces of wafers on the anode plate are in the same plane making the distances between the cathode and the wafer surfaces identical.

In such systems glass (e.g., quartz) deposition results in variation in thickness distributions which, at best, could only be optimized by variation in structure design and in control of processing parameters.

It has been found that variations in thickness are in part correlated to the distance of the top surface of the wafer from the adjacent surface of the source material (e.g., quartz cathode). Compensation for such differences in distribution can be provided by varying the individual spacing of the wafers and source in accordance with coating differences found.

One approach to the solution is shown in Fig. 1 which employs the use of spacers 1 in conjunction with the anode-quartz support 2 on anode 6. Spacers 1 will normally be of the same material as support 2, and their thickness is determined by the compensation required. In the embodiment shown, the planar dimensions will he sized to enable them to fit in substrate recesses 3, so that the wafer 4 position getting lesser amounts of a quartz coating is elevated proportionally closer to the source material.

In experiments performed with a 16-position wafer support 2 (in a 40MHz tuned sputtering system)...