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Bisolvent for Polyamide Imide Silane Module Overcoat System

IP.com Disclosure Number: IPCOM000086087D
Original Publication Date: 1976-Jul-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Dietz, MD: AUTHOR [+2]

Abstract

A bisolvent solution improves polyamide-imide-silane coating of solder reflow pads for semiconductor chips attached to a ceramic substrate or carrier, through the pads. The bisolvent solution provides for uniform coverage of the solder reflow pads by the protective coating. The solution also provides a nontoxic working environment.

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Bisolvent for Polyamide Imide Silane Module Overcoat System

A bisolvent solution improves polyamide-imide-silane coating of solder reflow pads for semiconductor chips attached to a ceramic substrate or carrier, through the pads. The bisolvent solution provides for uniform coverage of the solder reflow pads by the protective coating. The solution also provides a nontoxic working environment.

The following compound of solids and solutions have been found to be preferred for coating the solder reflow pads: Al-10 powder - 7.28 + or - 2% mg. A-1100 silane - 0.36 + or - 5% mg. A-186 silane - 0.36 + or - 5% mg. N-methyl-2- pyrrolidone (NMP) - 46.00 + or - 0.25% mg. 2-ethoxyethanol (EOE) - 46.00 + or - 0.25% mg.

A polyimide type III powder may be combined with the bisolvent solution in the following relation: Polyimide Type III Powder - 7.5 + or - 0.5% mg. NMP - 46.25 + or - 0.25% mg. EOE - 46.25 + or - 0.25% mg.

Approximately 80 to 90 miligrams of the compound are dispensed on a substrate including a semiconductor chip attached to solder reflow pads. The compound is heated to approximately 70 degrees C for twenty minutes using an infrared lamp. The 2-ethoxyethanol is rapidly evaporated which concentrates the remaining compound on the solder reflow pads without filleting. A final curing of the compound is performed by heating the substrate for 75 minutes at 100 degrees C; 75 minutes at 150 degrees C and 195 minutes at 190 degrees C.

The bisolvent system provides a safe w...