Browse Prior Art Database

Vapor System for Semiconductor Manufacture

IP.com Disclosure Number: IPCOM000086090D
Original Publication Date: 1976-Jul-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Driscoll, RG: AUTHOR [+2]

Abstract

In the apparatus of the drawing an adhesion promoter is deposited from the vapor phase on a semiconductor wafer 2. The adhesion promoter is carried in a suitable solvent in the liquid phase in a sump 3 of an enclosure 4. A heater vaporizes the adhesion promoter. Wafers 2 are mounted on holders 5 that are carried by a rod 6.

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Vapor System for Semiconductor Manufacture

In the apparatus of the drawing an adhesion promoter is deposited from the vapor phase on a semiconductor wafer 2. The adhesion promoter is carried in a suitable solvent in the liquid phase in a sump 3 of an enclosure 4. A heater vaporizes the adhesion promoter. Wafers 2 are mounted on holders 5 that are carried by a rod 6.

Rod 6 can be raised to bring the wafers 2 to the position shown in dashed lines, where one wafer is raised through an opening 7 in the wall of enclosure 4 for removing a coated wafer 2 and placing the next wafer to be coated on its holder 5. Rod 6 can also be rotated to bring successive wafers into the position of opening 7. Cooling apparatus 8 is located near opening 7, so that vapors that would otherwise escape from the enclosure are condensed and returned to sump
3.

When one of the wafers is raised through opening 7 other wafers enter a raised area 9 in container 4 and thereby remain in contact with the vapor. A pump 12 can be operated to purge area 9 of air that otherwise would be trapped. An opening 13 receives the exhaust piping 14 from pump 12, and cooling coils 15 condense vapors that otherwise would escape through opening 13 with air that is removed from region 9.

A thermometer 17 signals the temperature in raised area 9. the vapor temperature is higher than the temperature of trapped air, and the temperature tells when area 9 has been purged of air and warns when air leaks have occurred.

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