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Insulated Electrodes for Seam Sealing

IP.com Disclosure Number: IPCOM000086092D
Original Publication Date: 1976-Jul-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Horbert, TA: AUTHOR [+2]

Abstract

A parallel seam sealer is presently used for attaching protective cams for components on modules. The sealing power cycle is initiated by sensing electrical continuity between two parallel roller electrodes 14. It will be appreciated that where conductive paths are encountered before or after the desired seal lengths, extraneous or incorrect duration seal power cycles are initiated. This becomes particularly significant when attaching a very thin flanged cap or can directly to a substrate surface which has elevated lead wires thereon.

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Insulated Electrodes for Seam Sealing

A parallel seam sealer is presently used for attaching protective cams for components on modules. The sealing power cycle is initiated by sensing electrical continuity between two parallel roller electrodes 14. It will be appreciated that where conductive paths are encountered before or after the desired seal lengths, extraneous or incorrect duration seal power cycles are initiated. This becomes particularly significant when attaching a very thin flanged cap or can directly to a substrate surface which has elevated lead wires thereon.

This problem is solved in the parallel seam sealer by adding precisely machined cams to the work carriage which control the cycle, by vertically moving the electrodes in a predetermined path. A different cam set is required for each job.

The present arrangement solves the problem without adding cams by attaching insulating sleeves 10 on the outer sides of the two electrodes 14. These insulating sleeves 10 are made slightly larger in diameter than the electrodes 14 so that the electrodes will contact the raised edges to be sealed, but will be insulated from most other conductive paths. This arrangement is usable for any size package.

It can be seen from Figs. 1 and 2, that the substrate 11 moves relative to the electrodes 14. A solder preform is laid on the substrate 11 in the area where the protective cap is to be placed. Electrical leads are shown on the surface of the substrate which normally...