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Integrated Circuit Cooling Device

IP.com Disclosure Number: IPCOM000086160D
Original Publication Date: 1976-Jul-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Sachar, KS: AUTHOR

Abstract

Cooling of integrated circuitry is accomplished by the direct evaporation of a cooling liquid, distributed by capillary action in a thin layer over the reverse side of the integrated circuit substrate.

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Integrated Circuit Cooling Device

Cooling of integrated circuitry is accomplished by the direct evaporation of a cooling liquid, distributed by capillary action in a thin layer over the reverse side of the integrated circuit substrate.

Figs. 1 and 2 are sectional views of a heat pipe structure (assumed in this example to be of cylindrical shape), wherein a portion of the enclosing structure (e.g., one end of the cylinder) comprises the silicon wafer or substrate 1 of an integrated circuit chip 2 which is to be cooled. The remainder of the enclosure is provided by a housing 3 made of copper or other suitable heat conducting material. The reverse or interior side of the silicon wafer 1, opposite the chip 2, is finely grooved as indicated at 4 to provide capillary passageways for liquid.

The interior of the housing 3 is lined with a layer of porous material 5 which is saturated with a coolant, such as liquid nitrogen. The porous layer 5 extends partially over the interior face of the wafer 1 to the edges of the grooved area 4, leaving the grooves exposed to the interior space of the enclosure. The grooves 4 are not submerged in liquid. A tube 6 coiled around the housing 3 carries coolant to remove heat from the exterior of the housing.

The porous layer 5 serves as a wick for supplying liquid coolant to the capillary grooves 4 on the back of the silicon wafer 1. The grooves draw the coolant from this wick and spread it thinly over an area, which is much larger than t...