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Browse Prior Art Database

Semiconductor Substrate Cleaning Technique

IP.com Disclosure Number: IPCOM000086211D
Original Publication Date: 1976-Aug-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 24K

Publishing Venue

IBM

Related People

Amundsen, TA: AUTHOR

Abstract

Prior to processing semiconductor wafers for device manufacture, it is necessary to clean the surface thereof either mechanically, chemically or both depending upon subsequent process procedures.

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Semiconductor Substrate Cleaning Technique

Prior to processing semiconductor wafers for device manufacture, it is necessary to clean the surface thereof either mechanically, chemically or both depending upon subsequent process procedures.

A method found most beneficial is utilizing lambs wool, natural or synthetic bristles or the like, as a cleaning medium. An illustrative technique is shown in the drawing, wherein a suitable conveyor is utilized to convey wafers beneath a lambs wool covered cylindrical roller mounted in a manner so as to contact the entire wafer surface as it passes thereunder.

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