Browse Prior Art Database

Energy Conserving Method of Applying Backseals

IP.com Disclosure Number: IPCOM000086217D
Original Publication Date: 1976-Aug-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Ameen, JG: AUTHOR [+3]

Abstract

One of the final steps in producing a hybrid integrated circuit package, is the provision of a cover over the substrate and a substantially hermetic seal to provide an environment, which will be substantially unaffected by the ambient conditions in which the device is to be used.

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Energy Conserving Method of Applying Backseals

One of the final steps in producing a hybrid integrated circuit package, is the provision of a cover over the substrate and a substantially hermetic seal to provide an environment, which will be substantially unaffected by the ambient conditions in which the device is to be used.

As shown in the figure, the substrate 11 has the circuitized elements 13 mounted on the surface 12, which surface may also include additional circuit lines, etc. Connector pins 15 are contained in the substrate 11 and extend outwardly to provide connectors for the product in which the device is to be assembled.

To provide the substantially hermetic seal, the circuitized substrate 11 is placed in a cap 17, which has its inner walls 19 slightly beveled to provide a support point for the edges of the substrate 11. After the substrate 11 is placed in the cap 17, crimps 21 are made in the cap to secure the substrate in place. There may be, for example, eight such crimps made around the periphery of the cap 17.

Once this assembly is in place, a backseal of epoxy 23 is placed over the exposed surface of the substrate 11, thereby providing the substantially hermetic seal. Desirably the epoxy 23 extends into the air gap 25 between the edges of the substrate 11 and the walls of the cap 17, but does not extend down through the gap 25 onto the surface 12 of the substrate.

Using a suitable epoxy, it has been found that a satisfactory backseal can be made...