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Component Rework With Low Melt Solder

IP.com Disclosure Number: IPCOM000086219D
Original Publication Date: 1976-Aug-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Baron, PL: AUTHOR [+2]

Abstract

Components and printed-circuit boards and the like can be reworked with a low-melt solder in the solder fountain process, where the initial soldering process used a solder such as eutectic (63/37) solder, for example. A low-temperature solder can dissolve the hither melting eutectic alloy, thus allowing the component to be removed and replaced at a lower solder temperature. This substantially reduces the problems resulting from copper dissolution and card delamination. The solder fountain process is a very fast method for removing and replacing components soldered on a card.

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Component Rework With Low Melt Solder

Components and printed-circuit boards and the like can be reworked with a low-melt solder in the solder fountain process, where the initial soldering process used a solder such as eutectic (63/37) solder, for example. A low-temperature solder can dissolve the hither melting eutectic alloy, thus allowing the component to be removed and replaced at a lower solder temperature. This substantially reduces the problems resulting from copper dissolution and card delamination. The solder fountain process is a very fast method for removing and replacing components soldered on a card.

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