Browse Prior Art Database

Noncontact Electroplating

IP.com Disclosure Number: IPCOM000086220D
Original Publication Date: 1976-Aug-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Senger, RC: AUTHOR [+2]

Abstract

A process is described that permits tin plating of printed-circuit boards without physically contacting the board. The plating is achieved in the plated through holes and on the surface of the board which is closest to the tin source, as indicated in Fig. 1.

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Noncontact Electroplating

A process is described that permits tin plating of printed-circuit boards without physically contacting the board. The plating is achieved in the plated through holes and on the surface of the board which is closest to the tin source, as indicated in Fig. 1.

Tin/bismuth solder is used as the tin source with the solder being placed in a hot glycerin/NA(2)EDTA bath. The board to be plated is held above the molten solder, and an electrode held negative with respect to the solder is placed above the board. When the potential is applied between the solder bath and the electrode, the negative electrode plates with tin, as does the printed-circuit board. The upper portion of the printed-circuit board does not plate with tin during this operation.

An alternative approach is shown in Fig. 2 using a switching contact between the top electrode and the part to be plated. With this approach, deeper penetration of the tin plating into the plated through holes can be achieved, for example, using a cycle time of 10 seconds for connection to the top electrode and 2 seconds to the printed-circuit board to be plated.

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