Browse Prior Art Database

Multiple Pin Loader for Specialized Packaging Applications

IP.com Disclosure Number: IPCOM000086221D
Original Publication Date: 1976-Aug-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Lau, JA: AUTHOR [+3]

Abstract

This description relates to a process and associated tooling which allows simultaneous loading and precise placement of a plurality of pins on peripheral pads on a wafer deck, which is subsequently stacked with similar wafer decks.

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Multiple Pin Loader for Specialized Packaging Applications

This description relates to a process and associated tooling which allows simultaneous loading and precise placement of a plurality of pins on peripheral pads on a wafer deck, which is subsequently stacked with similar wafer decks.

The drawing shows, partially, the device employed in its assembled state at a stage in the process prior to brazing of the pins to the substrate pads. The device comprises a weight holding plate 10 with holes for retaining a plurality of weight pins 11, a pin holding plate 12 having shouldered holes 12a for retaining a plurality of headed pins 13, and a substrate holding plate 14 having alignment dowels 15 and a retaining clip 16 for holding a substrate 17 having a plurality of circuit pads, not shown, to which pins 13 are to be brazed. The fixture is made from any stable, machinable material, such as graphite.

At the start of a loading operation, the device is in a disassembled state. The weight holding plate 10 is inverted and loaded with the weight pins 11. The pin holding plate 12 is also inverted and positioned on a suitable source of vacuum and vibration.

A plurality of the headed pins 13 are poured onto the surface of plate 12 and the vacuum and vibration are actuated. Using a brush, the pins 13 are moved around until each cavity 12a contains a headed pin and then the vibration is turned off and the excess pins are brushed off.

With the pins 13 loaded, the vacuum is remo...