Browse Prior Art Database

Additive Plating on Ceramic Substrates

IP.com Disclosure Number: IPCOM000086223D
Original Publication Date: 1976-Aug-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Bakos, P: AUTHOR [+3]

Abstract

It is well known that finer circuit lines can be fabricated by additive processes as contrasted to subtractive processes. The following describes a series of steps for additively plating fine circuit lines on material such as fired ceramic substrates. 1. Photoresist is used to cover all areas except the desired circuit pattern. 2. A complexing solution containing palladium, nickel, gold, cobalt or copper dissolved in allylamine is applied to the entire surface. 3. The element is baked to decompose the complexing agent to its base metal, providing a thin film of metal in the areas where circuitry is desired. This film adheres to the ceramic substrate. 4. The element is placed in an electroless plating bath.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Additive Plating on Ceramic Substrates

It is well known that finer circuit lines can be fabricated by additive processes as contrasted to subtractive processes. The following describes a series of steps for additively plating fine circuit lines on material such as fired ceramic substrates. 1. Photoresist is used to cover all areas except the desired circuit pattern. 2. A complexing solution containing palladium, nickel, gold, cobalt or copper dissolved in allylamine is applied to the entire surface. 3. The element is baked to decompose the complexing agent to its base metal, providing a thin film of metal in the areas where circuitry is desired. This film adheres to the ceramic substrate. 4. The element is placed in an electroless plating bath. Metal will only adhere to the fine circuit line pattern where the metal film was previously deposited, thereby plating up fine circuit lines. 5. Solder barriers can be erected near the ends of the lines by coating all except the ends of the lines with an epoxy, such as a 10% solution of amid/imid polymer.

1