Browse Prior Art Database

Fabrication of Solid Via Structures in Organic Polymers

IP.com Disclosure Number: IPCOM000086261D
Original Publication Date: 1976-Aug-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 70K

Publishing Venue

IBM

Related People

Greer, SE: AUTHOR

Abstract

The fabrication of multilevel organic structures for use as both the dielectric medium and the wiring levels for silicon wafers, and first and second level packaging, requires the formation of interconnecting vias to distribute current and voltage to the various organic planes.

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Fabrication of Solid Via Structures in Organic Polymers

The fabrication of multilevel organic structures for use as both the dielectric medium and the wiring levels for silicon wafers, and first and second level packaging, requires the formation of interconnecting vias to distribute current and voltage to the various organic planes.

This is usually done by thick plating of metal vias or by the creation of a photoresist lift-off mask.

The process that follows simplifies the creation of these vias:

1) Deposit an organic layer 10 on substrate 12 by vacuum deposition or other conventional methods after initial 1st metal 14 is defined resulting in Fig. 1.

2) Place via mask 16 over substrate aligning holes in via mask 16 over area in organic which is to be removed, as shown in Fig. 2. A typical mask can be of molybdenum. All parts are held in a fixture, not shown, for alignment and are in close proximity.

3) Place aligned fixture in plasma ion etch chamber. Plasma ion etch in oxygen, which will penetrate and remove the organic only under the via openings in mask 16.

4) Without moving mask 16 or fixturing, place in metal evaporator. Deposit metal through via mask 16 until a thickness of metal equal to the organic layer thickness is obtained. Solid metal vias 18 have now been created without a photoresist operation, as shown in Fig. 3.

5) A second metal blanket deposit 20 followed by convention etching defines ground, signal or voltage planes.

6) Steps (2), (3), (4) are...