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Activation of Catalyst for Electroless Plating on Molybdenum

IP.com Disclosure Number: IPCOM000086270D
Original Publication Date: 1976-Aug-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Haddad, MM: AUTHOR [+2]

Abstract

Conventionally, molybdenum surfaces are activated for electroless nickel plating by a dip in a palladium chloride solution. Molybdenum metal goes into solution and a corresponding amount of palladium metal is deposited on the surface of the molybdenum. Only relatively small amounts of palladium are deposited, since the molybdenum surface is readily oxidized in air and the molybdenum oxide does not undergo the exchange reaction with palladium.

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Activation of Catalyst for Electroless Plating on Molybdenum

Conventionally, molybdenum surfaces are activated for electroless nickel plating by a dip in a palladium chloride solution.

Molybdenum metal goes into solution and a corresponding amount of palladium metal is deposited on the surface of the molybdenum. Only relatively small amounts of palladium are deposited, since the molybdenum surface is readily oxidized in air and the molybdenum oxide does not undergo the exchange reaction with palladium.

In this process, the activated molybdenum surface is immersed in an electroless nickel plating bath, typically an ammoniacal bath with 0.2 mole/liter of sodium hypophosphite, 0.1 mole/liter nickel sulfate and 0.1 mole/liter of sodium potassium tartrate with a pH of 11. It takes various lengths of time up to 20 minutes to build up the plating potential and to initiate the plating reaction.

In this process, after immersion in the palladium chloride solution of the molybdenum substrate, a typical application being a fired multi-layered ceramic module, the module is thoroughly dried and then dipped for ten minutes in a hypophosphite solution which has the same concentration, pH value, and temperature of the electroless nickel plating solution.

When the substrate is then immersed in the nickel plating bath, the nickel deposition starts almost instantly. By this method, there is provided a simple technique to insure a controlled and fast start of the plating to obtain a ...