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Corrosion and Contamination Protection for Liquid Cooled Semiconductor Devices

IP.com Disclosure Number: IPCOM000086274D
Original Publication Date: 1976-Aug-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Frieser, RG: AUTHOR [+3]

Abstract

In this method and structure, semiconductor chips solder bonded to a substrate and immersed in a liquid coolant are protected against contamination and corrosion, caused by boiling of the liquid coolant during operation.

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Corrosion and Contamination Protection for Liquid Cooled Semiconductor Devices

In this method and structure, semiconductor chips solder bonded to a substrate and immersed in a liquid coolant are protected against contamination and corrosion, caused by boiling of the liquid coolant during operation.

In a liquid cooled semiconductor package, a coolant is provided which absorbs the heat produced by the device or chip by vaporizing and subsequently condensing on the cover or cap of the package. When the devices are bonded to the substrate by flip-chip bonding techniques, there exists a space between the chip and the substrate. During normal operation, heat is generated by the chip which results in the formation of a bubble in the space between the chip and the substrate. This constant boiling of the coolant, causes any contamination in the liquid to precipitate out in the area of the solder bonds and the active elements on the chip. This could result in corrosion and contamination. Further, the bubble trapped between the chip and the substrate reduces the efficiency of the cooling operation.

In this technique and structure, a material is introduced between the chip and the substrate which prevents the formation of the bubble, and also promotes cooling by conduction through the substrate. A preferred material for this purpose is alumina powder due to its favorable heat conductivity. However, because of the geometry of the chip wherein a relatively narrow gap exists be...