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Controlling Coercivity of Plated Magnetic Films

IP.com Disclosure Number: IPCOM000086358D
Original Publication Date: 1976-Aug-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Barclay, DJ: AUTHOR [+2]

Abstract

The coercivity of a plated magnetic film is increased by rotating the substrate during the plating process.

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Controlling Coercivity of Plated Magnetic Films

The coercivity of a plated magnetic film is increased by rotating the substrate during the plating process.

In particular, the coercivity of an alloy film of platinum and cobalt (50:50 atomic ratio) is around 300 0e when plated onto a stationary substrate with the plating solution quiescent. Rotation of the substrate during plating at 10-100O RPM gives coercivities of > 700 Oe. Intermediate coercivities have been obtained by plating for 22050 seconds onto a rotating substrate and for a subsequent 1-5 minutes onto a stationary substrate with a quiescent solution.

The first plated layer is of high coercivity and is 200-400 angstroms thick, whereas the second plated layer is of low coercivity and is 300-700 angstroms thick. Exchange coupling between the two layers gives an overall coercivity of > 400 Oe.

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