Browse Prior Art Database

Laser Hole Drilling in Epoxy Glass

IP.com Disclosure Number: IPCOM000086405D
Original Publication Date: 1976-Sep-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Klauser, HE: AUTHOR [+2]

Abstract

A method for making extremely fine holes in the epoxy glass of printed circuit boards utilizes a uniform, reproducible high power laser pulse of about one millisecond duration focused onto the epoxy glass substrate with high-location accuracy. The laser pulses are generated using an apertured rotating disc, the laser being stationary. In addition, a flag shutter is adapted to be positioned in the path of the laser beam to selectively block the laser pulse from passing through the aperture in the disc when no pulses are required.

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Laser Hole Drilling in Epoxy Glass

A method for making extremely fine holes in the epoxy glass of printed circuit boards utilizes a uniform, reproducible high power laser pulse of about one millisecond duration focused onto the epoxy glass substrate with high-location accuracy. The laser pulses are generated using an apertured rotating disc, the laser being stationary. In addition, a flag shutter is adapted to be positioned in the path of the laser beam to selectively block the laser pulse from passing through the aperture in the disc when no pulses are required.

Utilizing this approach, a uniform energy density over substantially the entire duration of the laser pulse is derived to thereby satisfactorily drill the epoxy glass, which is essentially an inhomogenous material that cannot be easily drilled using current technology laser drilling schemes such as the Q-switch lasers or the electronically gated lasers.

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