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Browse Prior Art Database

Multilayer Ceramic Scanner Device Packaging

IP.com Disclosure Number: IPCOM000086407D
Original Publication Date: 1976-Sep-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 59K

Publishing Venue

IBM

Related People

Cistola, AB: AUTHOR [+2]

Abstract

Disclosed are alternate packages for providing a module-level package for optical scanner chips. Fig. 1 shows how the slot chip is mounted in a metallized ceramic module. An internal window is formed in a can with a hermetic seal around the window perimeter in contact with the chip surface. A parylene coating on the chip surface can provide both a window and a seal. The chip is attached to the metallized ceramic substrate using conventional techniques to secure the center of the chip with the underside edges floating on, for example, dummy pads. Wire bonds connect the metallized ceramic lands to the chip lands and a glass window is bonded to the underside of the can lip, if the parylene is not used.

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Multilayer Ceramic Scanner Device Packaging

Disclosed are alternate packages for providing a module-level package for optical scanner chips. Fig. 1 shows how the slot chip is mounted in a metallized ceramic module. An internal window is formed in a can with a hermetic seal around the window perimeter in contact with the chip surface. A parylene coating on the chip surface can provide both a window and a seal. The chip is attached to the metallized ceramic substrate using conventional techniques to secure the center of the chip with the underside edges floating on, for example, dummy pads. Wire bonds connect the metallized ceramic lands to the chip lands and a glass window is bonded to the underside of the can lip, if the parylene is not used.

In the alternative approach of Fig. 2, the metallized ceramic module is formed with a rectangular hole through it to provide an aperture, and the slot chip is mounted on the underside of the module. Interconnections between the chip and the module are again provided using conventional bonding techniques. A parylene coating protects the chips and provides visible wavelength transmission. The cover protects the chip on the bottomside and is bonded to the metallized ceramic module.

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