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High Density Buffered Test Probe

IP.com Disclosure Number: IPCOM000086414D
Original Publication Date: 1976-Sep-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Malin, JR: AUTHOR

Abstract

This packaging technique achieves extremely high density in packaging while allowing electrical flexibility to customize buffering in a test probe. It results in a reduction in the capacitance seen by the circuit under test and it makes it possible to probe test points on 0.1'' centers, and these points could be anywhere on a circuit card including adjacent via holes.

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High Density Buffered Test Probe

This packaging technique achieves extremely high density in packaging while allowing electrical flexibility to customize buffering in a test probe. It results in a reduction in the capacitance seen by the circuit under test and it makes it possible to probe test points on 0.1'' centers, and these points could be anywhere on a circuit card including adjacent via holes.

As shown in the drawings, use is made of an uncased chip 10 in a standard flat pack header 11. The chip is packaged with additional components 12, such as, compensation capacitors, and the pins wire bonded out so as to favor the packaging scheme as opposed to the normal way of bonding to the nearest pin. If desired, a thin printed-circuit board 13 may be cut out and the printed-circuit board used to wire circuitry and components 14, which are not possible to wire in the flat pack header 11.

Suitable probing points 15 can be soldered or welded to the appropriate tabs 16 and pins 17 or wires can be soldered or welded for connection to the rest of the circuitry. A suitable potting compound 18 may be used for mechanical rigidity. The finished probe can be used on 0.1'' centers and can probe two adjacent vertical points.

Other devices can be used in place of a buffer amplifier. Resistor-capacitor attenuators, diode detectors, level detectors, etc.; can be packaged this way. Requirements will vary with need and this packaging concept can accommodate wide variations in buff...