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Browse Prior Art Database

Film Thickness Monitor for RF Sputter Etching

IP.com Disclosure Number: IPCOM000086448D
Original Publication Date: 1976-Sep-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 27K

Publishing Venue

IBM

Related People

Brainard, EJ: AUTHOR [+4]

Abstract

A thickness monitor, which is a crystal-type thin film vacuum deposition monitor, is installed in an RF sputter etch chamber to monitor the removal of etched material.

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Film Thickness Monitor for RF Sputter Etching

A thickness monitor, which is a crystal-type thin film vacuum deposition monitor, is installed in an RF sputter etch chamber to monitor the removal of etched material.

Sensor head 1 of the monitor oscillates at the frequency of a quartz crystal. The mass of film deposited on the crystal changes the frequency, with the frequency shift being calibrated to thickness.

Sensor head 1 is mounted behind aluminum backing disk 2 which is on product wafer 3. During the sputter etch cycle, Al from backing disk 2 is removed and deposited on sensor head 1. The quantity of aluminum deposited on sensor head 1 is then converted to the quantity removed from disk 2.

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