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Browse Prior Art Database

Plating for Brazing

IP.com Disclosure Number: IPCOM000086454D
Original Publication Date: 1976-Sep-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

King, WJ: AUTHOR [+2]

Abstract

Fig. 1 illustrates a plated ceramic semiconductor module to which hermetic cans are brazed.

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Plating for Brazing

Fig. 1 illustrates a plated ceramic semiconductor module to which hermetic cans are brazed.

Problems are occasionally encountered after brazing of a can to the modules occasioned by bond failures between the nickel plating and the fritted molybdenum, under mechanical stress. Typically, the molybdenum contains about 30% Al(2)O(3) frit, with a significant portion present on the surface coated with nickel (e.g., Fig. 1). After plating with nickel, cracking was noted to occur at these surface sites of Al(2)O(3) particles, some of which protrude through the plating, to prevent diffusion of the nickel into the molybdenum in these areas.

Fig. 2 shows the application of an intermediate layer of ordinary frit-free molybdenum paste over the fritted molybdenum paste, which ensures a continuous plating of nickel that can be diffused into the entire added molybdenum layer. This provides better adhesion after reaction between the nickel plating and the brazing Au-Sn alloy.

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