Browse Prior Art Database

Stabilizing Liquid Cooled Semiconductor Devices

IP.com Disclosure Number: IPCOM000086456D
Original Publication Date: 1976-Sep-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Reeber, MD: AUTHOR

Abstract

In packaging large-scale integrated circuit semiconductor devices, cooling the operating devices may be accomplished by immersing the device in a suitable cooling liquid. In operation, the heat generated by the device causes the liquid to boil. This boiling of the liquid removes the heat from the device. However, a phenomenon known as "thermal overshoot" can occur, resulting in the catastrophic failure of the package when the liquid becomes superheated. When boiling ultimately does start, the action is violent.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Stabilizing Liquid Cooled Semiconductor Devices

In packaging large-scale integrated circuit semiconductor devices, cooling the operating devices may be accomplished by immersing the device in a suitable cooling liquid. In operation, the heat generated by the device causes the liquid to boil. This boiling of the liquid removes the heat from the device. However, a phenomenon known as "thermal overshoot" can occur, resulting in the catastrophic failure of the package when the liquid becomes superheated. When boiling ultimately does start, the action is violent.

This problem can be alleviated by providing the proper surface on the back side of the chip to provide nucleation sites which promote nucleate boiling. An additional property of certain specific treatments that has been observed is that generation of the gas continues, even though the chip temperature is below the nominal boiling point of the liquid coolant.

What is proposed is a system consisting of a heat transfer surface that exhibits the property of boiling persistence together with an operational requirement that the power in the chip be maintained at such a level that gas evolution continues, even though the circuit on the chip is not active or the machine is turned off. The system essentially maintains a suitable power level to certain circuits in order to achieve sufficient heating to maintain the boiling of the cooling liquid, even though no work is actually being done by the chip.

1