Browse Prior Art Database

Distribution System for Multilayer Ceramic Modules

IP.com Disclosure Number: IPCOM000086463D
Original Publication Date: 1976-Sep-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 50K

Publishing Venue

IBM

Related People

Markewycz, Z: AUTHOR

Abstract

In this structure, a multilayer ceramic module is provided with multiple pads which serve as the contact points for making electrical contact to the distribution system.

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Distribution System for Multilayer Ceramic Modules

In this structure, a multilayer ceramic module is provided with multiple pads which serve as the contact points for making electrical contact to the distribution system.

In the conventional structure, semiconductor modules, and in particular multilayer ceramic modules, are provided with brazed on pins which are secured in sockets, whereby electrical contact is made with the semiconductors mounted on the module. As the number of pins on the module increase, the difficulty with inserting and removing the module from the sockets becomes time-consuming because of the tolerance variations, and the alignment processes.

In this process, the multilayer ceramic substrate 10, shown with semiconductor devices 12 mounted on the top surface, is provided with a plurality of pads 14 on the bottom surface. In actual use, the substrate 10 is covered with a suitable cap. Liquid coolant may be provided for immersing the semiconductors 12.

A spring-biased pin contact element 16 which includes a pair of slidably mounted pins 18 biased outwardly by a suitable spring 20 and including a flange 22, is mounted in the socket board 24 provided with suitable apertures 26. The flange 22 fits in the recessed portion of aperture 26. A socket retainer board 28 is disposed over the element 16 retaining it in position.

A multilayer laminated input/output distribution board 30 is provided with pads 32 which contact the lower end of the slidable pin...