Browse Prior Art Database

Circuit Module With Ceramic Fin for Cooling

IP.com Disclosure Number: IPCOM000086496D
Original Publication Date: 1976-Sep-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 33K

Publishing Venue

IBM

Related People

Clark, BT: AUTHOR

Abstract

The drawing shows a sectioned view of a ceramic wafer 2 that supports a semiconductor chip 3 connected to conductive lands 4 on the substrate by solder balls 5. Lands 4 are electrically connected to a pin 6. A metal cap 7 encloses the chip and the lands. Heat transfer from the chip conventionally occurs through the solder balls and the lands to pin 6 and also from the wafer to the cap and from both the wafer and the cap to the air.

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Circuit Module With Ceramic Fin for Cooling

The drawing shows a sectioned view of a ceramic wafer 2 that supports a semiconductor chip 3 connected to conductive lands 4 on the substrate by solder balls 5. Lands 4 are electrically connected to a pin 6. A metal cap 7 encloses the chip and the lands.

Heat transfer from the chip conventionally occurs through the solder balls and the lands to pin 6 and also from the wafer to the cap and from both the wafer and the cap to the air.

The ceramic wafer has a peripheral flange 9 that forms a fin for additional heat transfer to the air. In addition, an overhang 12 on the fin 9 forms a retainer for cap 7. A sealing material 13 is placed at the joint of the fin and the cap.

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