Browse Prior Art Database

Circuit Module with Gallium Metal Cooling Structure

IP.com Disclosure Number: IPCOM000086504D
Original Publication Date: 1976-Sep-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Jeannotte, DA: AUTHOR

Abstract

The drawing shows a sectional view of a circuit module having a conventional substrate 2, a semiconductor chip 4 connected to lands (not shown) on the substrate by means of solder pads 6 and having pins 8 for electrical connection to other components. This structure has a cap that is made up of a peripheral flange 12 and a cover 13 that has fins 14 and forms a heat sink.

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Circuit Module with Gallium Metal Cooling Structure

The drawing shows a sectional view of a circuit module having a conventional substrate 2, a semiconductor chip 4 connected to lands (not shown) on the substrate by means of solder pads 6 and having pins 8 for electrical connection to other components. This structure has a cap that is made up of a peripheral flange 12 and a cover 13 that has fins 14 and forms a heat sink.

The chip, the other electrical components on the substrate, and the flange 12 are covered with a thin dielectric layer 15. Gallium metal 16 is located in the space between dielectric layer 15 and the heat sink. Gallium melts at the normal operating temperature of the module and it forms a good heat transfer path from the chip to the heat sink. The heat sink is shaped to have relief spaces 18 for expansion of the gallium. A pin 22 extends through the dielectric layer 15 to make electrical contact with the gallium for maintaining the gallium at ground potential.

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