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Magnetic Self Alignment of GaAs Laser Arrays to Heat Sink Arrays

IP.com Disclosure Number: IPCOM000086564D
Original Publication Date: 1976-Sep-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Hutchins, GL: AUTHOR

Abstract

This approach provides a solution to the problem of aligning laser contact stripes (which are inherently buried) to their corresponding stripes on an integrated heat-sink. It replaces the optical fine alignment of laser arrays to integrated heat-sinks and is conducive to automated, nonoptical, laser array chip bonding.

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Magnetic Self Alignment of GaAs Laser Arrays to Heat Sink Arrays

This approach provides a solution to the problem of aligning laser contact stripes (which are inherently buried) to their corresponding stripes on an integrated heat-sink. It replaces the optical fine alignment of laser arrays to integrated heat-sinks and is conducive to automated, nonoptical, laser array chip bonding.

In the figure, a heat-sink metallization array 10 for a solid state chip is composed of a magnetic material or a material that is magnetized by a remote source and the corresponding array 14 on the chip 12 is composed of a metal attracted by magnetized heat-sink fingers of array 10. Thus, chip alignment is obtained by placing chip 12 over array 10 in close proximity (and in crude alignment), then letting chip 12 fall onto array 10 with the magnetic forces adjusting chip alignment in flight or after touchdown to the heat-sink. Compensation for both displacement and rotational misalignment occurs. A normal bonding cycle with usual metallurgy deposited over the magnetic fingers completes the bond.

Chip 12 is an array laser chip with emitting laser spots 16. Heat-sink 18 comprises a copper plate 19 coated with an oxide 20 upon which the magnetic Ni-Fe heat-sink array 10, capped with a bonding metal, rests. The wire 22 provides the magnetic field which magnetizes array 10 and array 14.

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