Browse Prior Art Database

Pressure Sensitive Tape Preform and Application

IP.com Disclosure Number: IPCOM000086648D
Original Publication Date: 1976-Oct-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Christie, FR: AUTHOR [+2]

Abstract

Preforms made from pressure-sensitive adhesive tapes are used in packaging of electronic components.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 76% of the total text.

Page 1 of 1

Pressure Sensitive Tape Preform and Application

Preforms made from pressure-sensitive adhesive tapes are used in packaging of electronic components.

The tape from which the preforms are cut has a layer of stretchable material, such as TEFLON*, one surface of which is coated with an adhesive. The tape is provided with a strippable backing member which adheres to the tape's adhesive. Precuts formed from the tape, when subsequently removed from the backing member, have the tendency to curl and deform, i.e., not remain flat. This made it difficult to handle the preform and position it on the particular article with which it is to be associated.

To overcome this problem, an inexpensive adhesive second tape, such as masking tape, is placed on the nonadhesive surface of the TEFLON layer. The second tape acts as a secondary backing member. Thus, after the preforms are cut and the primary backing removed, the secondary backing member prevents the preform from deforming and thus facilitates handling of the preform. After the preform is applied to the particular article, the secondary backing member is stripped from the preform.

In one application, the preform, in coaction with the secondary backing member, is applied to an electrical component. With the secondary backing member stripped, a curable and conformable adhesive material is then placed between the nonadhesive TEFLON surface of the preform and a heat-sink member to which the component is to be mounted. When cured,...