Browse Prior Art Database

LSI Chip Removal and Dressing Tool

IP.com Disclosure Number: IPCOM000086649D
Original Publication Date: 1976-Oct-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Harris, EJ: AUTHOR [+2]

Abstract

In the rework of large scale integration (LSI) devices, it is often required to remove one or more defective circuit chips from the substrate to which it is soldered. This combination tool provides for the removal of the chip and the dressing of the substrate site from which the chip has been removed. i.e., removal of the solder.

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LSI Chip Removal and Dressing Tool

In the rework of large scale integration (LSI) devices, it is often required to remove one or more defective circuit chips from the substrate to which it is soldered. This combination tool provides for the removal of the chip and the dressing of the substrate site from which the chip has been removed. i.e., removal of the solder.

The chip removal gripper tool 1 and solder chisel 2 are coplanar mounted on a turret head 3, which is capable of incremental bidirectional movement along the Z axis. The LSI substrate (not shown), with its chips (not shown) facing upwards, is mounted to the carriage 4, which is part of the XY positioning table 5. The table 5 is positioned so that the defective chip to be removed is in alignment with the head 3. In turn, head 3 is incremented to position the bifurcated pronged tip T of tool 1 next to the chip to be removed. Tip T is provided with an inverted L- shape configuration which conforms to and engages the edge formed by the side and top of the defective chip.

Next, table 5 is moved to the left, as viewed facing the figure, causing the solder connection between the chip and substrate to be fractured resulting in the chip being disconnected therefrom. After the chip is removed, head 3 is rotated so as to place the tip T' of chisel 2 adjacent the removal site of the substrate, and by coaction of the adjustments to the head 3 along the Z axis and the reciprocating movement of the table 5 along the X...