Browse Prior Art Database

Energy Absorbing Clutch Latch

IP.com Disclosure Number: IPCOM000086697D
Original Publication Date: 1976-Oct-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Boyatt, RG: AUTHOR [+2]

Abstract

A way to reduce the impact loads on a clutch latch is shown in the figure. If spring relief were done in the conventional manner by allowing straight line motion of latch 10 into a spring or shock absorbing pad, the contact between latch 10 and release ring 12 would become line contact during the deflection, contributing to an unstable latch condition and also to accelerated wear.

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Energy Absorbing Clutch Latch

A way to reduce the impact loads on a clutch latch is shown in the figure. If spring relief were done in the conventional manner by allowing straight line motion of latch 10 into a spring or shock absorbing pad, the contact between latch 10 and release ring 12 would become line contact during the deflection, contributing to an unstable latch condition and also to accelerated wear.

This mechanism provides a solution to these problems. Latch 10 is pinned to trip arm 14 with stud 16 and, also, is guided by pivot stud 18. Latch 10 can move relative to trip arm 14 in slots 20 and 22, which are circular slots swung from the center of release ring
12. Latch 10 is biased in a counterclockwise direction by rubber pad
24. During latch-up, energy is taken from the clutch and release ring 12 by allowing rubber pad 14 to deflect under the impact load.

The impact force causes latch 10 to compress rubber pad 24 and move in a clockwise manner about the center of release ring 12 sliding on pins 18 and 16. This motion allows trip arm 14 to remain stationary.

The fact that slots 20 and 22 are circular slots swung about the center of release ring 12 to remain constant and prevents line contact from occurring. Immediately after, impact rubber pad 24 will return latch 10 to its original position with respect to the other clutch hardware.

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