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Special Thermal Module for Electronic Assembly Thermal Testing

IP.com Disclosure Number: IPCOM000086698D
Original Publication Date: 1976-Oct-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 50K

Publishing Venue

IBM

Related People

Bailey, JR: AUTHOR [+2]

Abstract

The testing of a thermal mock-up of the electronics in a machine may be improved by using thermal modules described herein. These modules are constructed by attaching a thick-film resistor chip 12 onto the top of an electronic chip 13 in a first-level package. Any predetermined wattage is achieved by trimming the mounted resistor 10.

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Special Thermal Module for Electronic Assembly Thermal Testing

The testing of a thermal mock-up of the electronics in a machine may be improved by using thermal modules described herein. These modules are constructed by attaching a thick-film resistor chip 12 onto the top of an electronic chip 13 in a first-level package. Any predetermined wattage is achieved by trimming the mounted resistor 10.

When the mock-up utilizes these modules, a single voltage can power the entire thermal mock-up and thereby reduce the complexity of the test. The module pin 16 temperatures will be the same as if the electronic chip 13 itself powered the module.

This module is constructed by removing the protective cap of the module to be used as a thermal module and mounting a thick-film resistor 10 onto the chip
12. Resistor 10 will generate the heat desired for the thermal test. After mounting, the resistor 10 can be trimmed to 1%. The resistor is then electrically connected to two pins 14 by conductors 18. Thus, after replacing the cap on the module, there are only two functional pins 14 that supply voltage to the resistor. All other pins 16 are not electrically functional but remain in place to conduct heat.

A printed-circuit board can be populated with any number of these special thermal modules. During thermal testing the modules are powered with a single supply voltage. Thermocouples read the pin temperatures of these modules to give the required thermal test data.

Thermal testing of modu...