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Metal Mask Fabrication from Etched Diclad

IP.com Disclosure Number: IPCOM000086727D
Original Publication Date: 1976-Oct-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 69K

Publishing Venue

IBM

Related People

Gibney, JT: AUTHOR [+3]

Abstract

In the IBM Technical Disclosure Bulletin, Vol. 18, No. 9, Feb. 1976, pp. 3069-3070, J. Crimi et al describe a subtractive method for fabricating electroform masks (suitable for screening ceramic pastes in printed-circuit processes), from a three-layer (triclad) form. Nickel film layers on opposite sides of a copper foil base layer are pattern-etched by an etchant which does not attack the copper and, after suitable handling (e.g., rinsing), the copper is pattern-etched by an etchant which does not attack the nickel. Although not explicitly shown in this article, the pattern in the top-layer pattern is differentiated from that in the bottom layer by support tab bridging constructions spanning "long thin" lines in the latter pattern as dimensional reenforcements.

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Metal Mask Fabrication from Etched Diclad

In the IBM Technical Disclosure Bulletin, Vol. 18, No. 9, Feb. 1976, pp. 3069-3070, J. Crimi et al describe a subtractive method for fabricating electroform masks (suitable for screening ceramic pastes in printed-circuit processes), from a three-layer (triclad) form. Nickel film layers on opposite sides of a copper foil base layer are pattern-etched by an etchant which does not attack the copper and, after suitable handling (e.g., rinsing), the copper is pattern-etched by an etchant which does not attack the nickel. Although not explicitly shown in this article, the pattern in the top-layer pattern is differentiated from that in the bottom layer by support tab bridging constructions spanning "long thin" lines in the latter pattern as dimensional reenforcements.

An alternative construction of a two-layered (diclad) form is shown in the accompanying drawing. Base foil layer 2 (e.g., copper or an iron alloy) supports a single film layer 4 (e.g., nickel, aluminum or alloy 42). Top and bottom resist coatings 6 and 8 are photo-processed in desired patterns including bridging constructions 10 in the top pattern extending crosswise over "long lines" in the bottom pattern (and across similar lines in the top pattern).

The resulting configuration is exposed to an etchant which attacks the material of film layer 4 but not that of foil base 2, producing the configuration of Fig. 2. After suitable handling (e.g., rinsing) the composit...