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Rupture Test for Circuit Module

IP.com Disclosure Number: IPCOM000086730D
Original Publication Date: 1976-Oct-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Best, B: AUTHOR

Abstract

This apparatus is used for a rupture test on a ceramic module 2. The module is clamped with seal rings 3 and 4 between an upper pressure chamber 5 and a lower rectangular flange 6 by screws 7. Pressure chamber 5 is filled with water or other noncompressible liquid 8 and is connected to a hand-operated hydraulic pump 9 by lines 10 and 11 and a cylinder 12 that forms an accumulator for hydraulic fluid from pump 9 and water from chamber 5. Pump 9 has a pressure gauge 13.

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Rupture Test for Circuit Module

This apparatus is used for a rupture test on a ceramic module 2. The module is clamped with seal rings 3 and 4 between an upper pressure chamber 5 and a lower rectangular flange 6 by screws 7. Pressure chamber 5 is filled with water or other noncompressible liquid 8 and is connected to a hand-operated hydraulic pump 9 by lines 10 and 11 and a cylinder 12 that forms an accumulator for hydraulic fluid from pump 9 and water from chamber 5. Pump 9 has a pressure gauge 13.

The assembly of module 2 and pressure chamber 5 is put into a container 14 of water 15 or other suitable liquid. Pump 9 is operated to pressurize module 2 until it ruptures. The liquid 15 damps the motion of broken pieces of the module and permits these pieces to be recovered intact for study.

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