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Heat Dissipation Using Thermally Conducting Putty

IP.com Disclosure Number: IPCOM000086732D
Original Publication Date: 1976-Oct-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Neumann, EW: AUTHOR

Abstract

A thermally conductive filled silicone polymer Pn the form of a putty can be used to aid in heat dissipation from a circuit card on which irregularly shaped heat generating components are mounted. The putty is packed onto the card and surrounds each of the components, thereby providing intimate contact for efficient heat transfer to a cold plate or other heat exchanger. Components on the card can be readily recovered by simply removing the putty.

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Heat Dissipation Using Thermally Conducting Putty

A thermally conductive filled silicone polymer Pn the form of a putty can be used to aid in heat dissipation from a circuit card on which irregularly shaped heat generating components are mounted. The putty is packed onto the card and surrounds each of the components, thereby providing intimate contact for efficient heat transfer to a cold plate or other heat exchanger. Components on the card can be readily recovered by simply removing the putty.

A suitable putty can consist of 33% by weight of a silicone gum and 67% by weight of HYDRAL*, a hydrated aluminum oxide. There are no plasticizers to cause "bleeding" and the material has zero slump at 180 degrees C. * Trademark of Aluminum Company of America.

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