Browse Prior Art Database

Circuit Module With Removable Cap

IP.com Disclosure Number: IPCOM000086735D
Original Publication Date: 1976-Oct-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 33K

Publishing Venue

IBM

Related People

Cain, OJ: AUTHOR [+2]

Abstract

The figure shows a conventional ceramic wafer 2, a silicon chip 3, and solder balls 4 that connect terminals on the chip to conductors (not shown) on the module that lead to pins 5. Modules are commonly used in corrosive environments, and an improved cap 7 is provided to protect the chip.

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Circuit Module With Removable Cap

The figure shows a conventional ceramic wafer 2, a silicon chip 3, and solder balls 4 that connect terminals on the chip to conductors (not shown) on the module that lead to pins 5. Modules are commonly used in corrosive environments, and an improved cap 7 is provided to protect the chip.

Cap 7 is removably connected to a spacer 8. Cap 7 and spacer 8 are made of a metal having suitable characteristics of corrosion resistance and of thermal expansion with respect to wafer 2. The spacer is brazed to a metal base layer 9 that is formed on the wafer.

Spacer 8 has outwardly-facing serrations that match inwardly-facing serrations on the cap. The serrations on the spacer and on the cap are coated with a layer 12 of a plastic that is suitable for a seal.

For assembly the module is placed in a vacuum chamber and the cap is snapped over the spacer. The air pressure in the normal operating environment of the module helps to hold the cap sealed against the spacer. The module is returned to a vacuum chamber for removing the cap.

As shown, the cap and spacer are square. However the cap and spacer may be circular and the serrations may be in the form of threads for removably screwing the cap onto the spacer.

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