Browse Prior Art Database

Inner Fin Air Cooled Module

IP.com Disclosure Number: IPCOM000086736D
Original Publication Date: 1976-Oct-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Gupta, OR: AUTHOR

Abstract

The present air-cooled module has limited power capability since the heat transfer from the chip within the module is not sufficient to maintain the required junction temperature during higher power operation. The heat-transfer path is from the chip 10 through the solder balls 12 which connect the chip to a substrate 14. The heat is diffused through the substrate and passes through the bonding material 16, which is provided in the junction between the substrate 14 and can or cover 18.

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Inner Fin Air Cooled Module

The present air-cooled module has limited power capability since the heat transfer from the chip within the module is not sufficient to maintain the required junction temperature during higher power operation. The heat-transfer path is from the chip 10 through the solder balls 12 which connect the chip to a substrate 14. The heat is diffused through the substrate and passes through the bonding material 16, which is provided in the junction between the substrate 14 and can or cover 18.

The parallel heat-transfer path and the consequent higher power operation capability of the chip is obtained by bonding or soldering the fin 20 to the back surface of the chip 10. The fin 20 is arranged to have a large surface area and to be located at a small space from the adjacent can 18 surfaces. The voids between the fin 20 and the can 18 are filled with a suitable high-heat conducting fluid 22, such as helium. Thus, the parallel heat-transfer path is from the backside of the chip 10 into the fin 20. This heat is transferred from the surface of the fin 20 to the can 18 through the heat conductive junction there-between. Of course, the heat transfer improves with the increase in the thermal conductivity of the filler fluid 22.

A cold plate or other fins can be added to the outside of the can 18 to further improve the heat transfer path.

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