Browse Prior Art Database

Low Cost Cooling Package

IP.com Disclosure Number: IPCOM000086780D
Original Publication Date: 1976-Apr-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 56K

Publishing Venue

IBM

Related People

Nuccio, C: AUTHOR

Abstract

The drawing shows a section of a cylindrical enclosure for a ceramic wafer 2 and a liquid 3 that cools logic and storage components, not shown, that are carried on the wafer. The wafer 3 is square and the section in the drawing is through a diagonal of the wafer. The wafer is sealed to a metal support 4 at its lower surface where pins 5 make electrical connection to a supporting circuit board, not shown. (The drawing shows components 4 and 5 and other components spaced apart for clarity.)

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Low Cost Cooling Package

The drawing shows a section of a cylindrical enclosure for a ceramic wafer 2 and a liquid 3 that cools logic and storage components, not shown, that are carried on the wafer. The wafer 3 is square and the section in the drawing is through a diagonal of the wafer. The wafer is sealed to a metal support 4 at its lower surface where pins 5 make electrical connection to a supporting circuit board, not shown. (The drawing shows components 4 and 5 and other components spaced apart for clarity.)

The support 4, cylindrical side walls 6, and an upper circular cover 7 are connected by ring-shaped flanges 8, 9 and 10, an upper seal 11 and a lower seal
12. The upper cover 7 has a fill port for the cooling liquid. A spiral of cooling coils 14 cool the upper cover 7 and a helix of cooling coils 15 cool the walls 6.

Fins 16 are mounted on upper cover 7 and extend radiallv outward from a central vapor space. A cone shaped chimney 17 directs vapors from cooling liquid 3 upward through the vapor space and radially outward along the cooled fins 16 toward the cooled outer wall 6. A cone-shaped baffle 19 helps to isolate the path of the heated rising vapor from the radial and downward path of the cooling and condensing vapor. As vapor condenses on fins 16 and wall 6, the condensate returns to cool the components of wafer 2.

1

Page 2 of 2

2

[This page contains 3 pictures or other non-text objects]