Browse Prior Art Database

Chrome/Copper Laminated Stud Via

IP.com Disclosure Number: IPCOM000086877D
Original Publication Date: 1976-Nov-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Fedrowitz, W: AUTHOR

Abstract

In multilevel glass metal module packages consisting of alternating layers of evaporated metal and fired glass, the interconnections are formed of evaporated copper stud vias. Because of nonwetting between metal and glass and mismatching expansion coefficients, a small gap is created between the stud walls and glass during processing. This gap provides a depository for moisture and contaminants causing outgassing during subsequent processing, which eventually results in large bubble voids being formed. This prevents the successful construction of additional layers.

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Chrome/Copper Laminated Stud Via

In multilevel glass metal module packages consisting of alternating layers of evaporated metal and fired glass, the interconnections are formed of evaporated copper stud vias. Because of nonwetting between metal and glass and mismatching expansion coefficients, a small gap is created between the stud walls and glass during processing. This gap provides a depository for moisture and contaminants causing outgassing during subsequent processing, which eventually results in large bubble voids being formed. This prevents the successful construction of additional layers.

The figure shows a structure which provides better glass to metal wetting which substantially eliminates moisture and contamination paths. The stud structure 1, which can be formed by evaporation, consists of alternating layers of copper 2 and chrome 3. The first four layers of copper are, for example about 12.5 mu in thickness and the top four layers are about 6.25 mu. The chrome layers are about 2500 Angstroms.

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