Browse Prior Art Database

Remover for Peripheral Resist Build Ups

IP.com Disclosure Number: IPCOM000086903D
Original Publication Date: 1976-Nov-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Wetz, H: AUTHOR

Abstract

Resist build-ups on the edges of the substrates cannot be avoided during the spin coating of resist layers on a wafer or substrate. These buildups occur increasingly when the required resist thickness required exceeds 1 mu m. Such peripheral build-ups detrimentally affect the subsequent exposure process, since they impair the optical resolution and may damage the masks.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 74% of the total text.

Page 1 of 2

Remover for Peripheral Resist Build Ups

Resist build-ups on the edges of the substrates cannot be avoided during the spin coating of resist layers on a wafer or substrate. These buildups occur increasingly when the required resist thickness required exceeds 1 mu m. Such peripheral build-ups detrimentally affect the subsequent exposure process, since they impair the optical resolution and may damage the masks.

Therefore, additional process steps have to be introduced to remove the peripheral build-ups. These include the careful determination and control of the concentration of the diluent in the resist (viscosity) and the acceleration of the spinning table in such a manner that the build-ups remain below a predetermined level. In addition, stripping or wiping solutions or an edge expose process can be used. However, none of these approaches are entirely satisfactory.

A particularly advantageous solution to the problem consists in blowing off the peripheral resist build-ups on a wafer or substrate by suitably directed jets 2. Depending upon the shape of the substrate, jet plate 3 can be provided with one or several jets 2 which are designed as point or slot jets (e.g., in the case of angular substrates). Blowing off is effected with the substrate stationary or in the spin coating step. To prevent the gas flow from speeding up the drying of the resist, applied in liquid form, and thus the generation of peripheral build-ups, a gas containing a suitable resist solvent...