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Electrostatic Synchronization in Ink Jet Heads

IP.com Disclosure Number: IPCOM000086960D
Original Publication Date: 1976-Nov-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Doo, VY: AUTHOR [+2]

Abstract

Uniform drop synchronization in a multiple nozzle ink jet head is achieved by the fabrication of electrodes on a substrate by etching without the use of photolithography.

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Electrostatic Synchronization in Ink Jet Heads

Uniform drop synchronization in a multiple nozzle ink jet head is achieved by the fabrication of electrodes on a substrate by etching without the use of photolithography.

In Fig. 1 a thin metal film 2, which is used as a synchronizing electrode is deposited on a silicon nozzle substrate 4, and an insulating film 6 is sputtered onto the metal film. The insulating film may be SiO(2), Si(3)N(4) or Al(2)O(3). The resputtering effect should be minimized such that little insulating material is deposited on the edge of the metal film. The wafer may then be briefly dip- etched to clean up the metal etch.

Fig. 2 illustrates the substrate which has now been dip-etched in a metal etchant to undercut the metal film 2 at the exposed edges, as illustrated at 8. The amount of unidirectional undercut is controlled easily by adjusting the etching solution, time and/or temperature. A metal wire 10 may be connected to the metal film 2 such that a synchronizing signal from a source (not shown) may be applied.

The use of a unidirectional undercut spaces the synchronizing electrodes from the ink jet stream, thereby eliminating electrical shorting to the ink stream while maintaining control synchronization.

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