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Etching Holes in Foil

IP.com Disclosure Number: IPCOM000087032D
Original Publication Date: 1976-Dec-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

DePew, JR: AUTHOR [+2]

Abstract

Closely spaced holes are etched in metal sheets thicker than the hole diameters.

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Etching Holes in Foil

Closely spaced holes are etched in metal sheets thicker than the hole diameters.

Extremely small holes, on the order of three mils diameter, cannot be reliably formed in relatively thick (about six mils) foil by conventional spray etch or immersion techniques due to undercutting and other deleterious phenomena. Here, stainless steel foil, covered with photo-resist patterns on both sides, forms the anode in a reverse-plating (electroetch) bath. The cathodes are two platinum wires or foils. Dilute (about 20 degrees Baume) room-temperature ferric chloride solution is the etchant.

The power supply must provide constant current having an initial density of at least 10 ASI and preferably about 15 ASI. Etch time is a function of the total initial current level.

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