Browse Prior Art Database

Wafer Holding Vacuum Check

IP.com Disclosure Number: IPCOM000087059D
Original Publication Date: 1976-Dec-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

LaRue, AJ: AUTHOR

Abstract

The article, "Wafer Holding Pedestal", by P. Fiore and Q. K. Yuan, IBM Technical Disclosure Bulletin, Vol. 13, No. 12, May 1971, page 3651, describes a vacuum chuck for semiconductor wafers which includes a stainless-steel controlled porosity disk for uniform vacuum distribution. The disk is formed from a sintered powder and has omnidirectional pores. Vacuum retention characteristics can be altered when warped or out-of-flat wafers fail to contact substantially all of the surface area of the disk.

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Wafer Holding Vacuum Check

The article, "Wafer Holding Pedestal", by P. Fiore and Q. K. Yuan, IBM Technical Disclosure Bulletin, Vol. 13, No. 12, May 1971, page 3651, describes a vacuum chuck for semiconductor wafers which includes a stainless-steel controlled porosity disk for uniform vacuum distribution. The disk is formed from a sintered powder and has omnidirectional pores. Vacuum retention characteristics can be altered when warped or out-of-flat wafers fail to contact substantially all of the surface area of the disk.

Vacuum efficiency is improved by replacing the sintered disk with a porous plate formed of a plurality of compacted layers of wire mesh fused together so as to form a rigid plate of appropriate diameter and thickness. Fusing the layers has the effect of creating small parallel channels through the disk, and provides vacuum holding power proportional to the surface area of the disk contacted by a wafer.

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