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Cores Used as Plated Mandrels and Planishing Plates

IP.com Disclosure Number: IPCOM000087068D
Original Publication Date: 1976-Dec-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Haining, FW: AUTHOR [+2]

Abstract

An alternative to the conventional peel-apart method for applying a thin copper foil to a laminate in the production of printed circuit boards consists of the following steps: A planishing plate in the form of a laminate prepared in the usual manner with one ounce copper foil on both surfaces is treated so that the surface of the carrier will function as a parting layer in a subsequent operation. A thin copper layer is then plated on the treated surfaces of the carrier and the additionally plated copper surface is suitably finished to maximize its adhesion to epoxy.

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Cores Used as Plated Mandrels and Planishing Plates

An alternative to the conventional peel-apart method for applying a thin copper foil to a laminate in the production of printed circuit boards consists of the following steps: A planishing plate in the form of a laminate prepared in the usual manner with one ounce copper foil on both surfaces is treated so that the surface of the carrier will function as a parting layer in a subsequent operation. A thin copper layer is then plated on the treated surfaces of the carrier and the additionally plated copper surface is suitably finished to maximize its adhesion to epoxy. The next step includes laying up the treated cores in a laminating press with a sufficient amount of epoxy glass prepreg between the treated cores to form composites of the desired thickness and then laminating the lay up under heat and pressure to form the permanent bonds between the epoxy glass and the treated surface of the thin copper foil or foils.

Next, the laminated lay up separates the treated cores from the thin copper at the plating layer so that the thin copper is transferred to the epoxy glass, thereby forming a composite with the thin copper on both surfaces. Then subsequent printed circuit configurations are accomplished according to conventional circuit generation techniques.

In treating the laminated copper to form the release layer, a number of techniques are available, such as using an electroless copper which has a much higher etch...